Product Specifications

    Contact

    Name: Shanghai Pu Chun Electronics Co., Ltd.
    Add: No.2538,Husong Highway,Songjiang District,Shanghai,China
    Zip: 201601
    Tel: 0086-21-57621370、 0086-21-5762137
    Fax: 0086-21-57621223

    Product Specifications

    PCB Catalog Specification
    Specification Single Side Double Side SS/DS
    Laminate Material FR-1 FR-2 CEM-1 CEM-3 FR-4 CEM-3 FR-4 Other
    Thickness of 0.8;1.0; 1.0;1.2; 0.6;0.8;1.0;  
    Laminate (mm) 1.2;1.6 1.6 1.2;1.6 or other
    Cu Thickness (μ) 18;35;70 or more  
    Min. Line Width 0.15 0.2  
    and Space (mm)
    Surface Processing              
    SMOBC and PL
    Flux Coating      
    Ni/Au Plating
    HAL        
    OSP      
    Gold Fingers        
    Carbon/Silver      
    Ink Printing
    Min. Diameter of 0.7 0.4  
    Finished Hole (mm)
    Making Holes      
    Punching        
    CNC Drilling      
    Making Outline                
    Punching
    CNC Routing            
    Packing                
    Kraft Paper    
    and Carton
    Plastic Film    
    and Carton
    Plastic Bubble            
    Film with Vacuum
    Plastic Anti-static
    Bag and Box
    Disinfecting with    
    γ-ray
    Other                
    Note:SMOBC=Solder Mask over Bare Copper;
       PL=Printed Legend;
       HAL=Hot Air Leveling;
       OSP=Organic Solderability Preservatives.

    Mounting equipment capacity list
    Equipment Brand Model Q'ty Speed Precision Note
    Sec./point
    Auto TACHEN TC-3040 6 -- 0.5mm Stencil Max
    screen pitch 735×735mm
    printer SMTech Sigma 1 -- 0.3mm Stencil Max
      Printer pitch 584×584mm
      400    
      DEK DEK265LT 1 -- 0.3mm Stencil Max
      pitch 736×736mm
      DEK DEK265ELA 2 -- 0.3mm Stencil Max
      pitch 736×736mm
    Dispensers JUKI KD770 1 0.38 ±0.15mm Double spindles
    JUKI KD775 1 0.1 ±0.10mm Three spindles
    YAMAHA YD64D 2 0.13 ±0.10mm Double spindles
    Mounters JUKI KE750 7 0.25 ± PCB:
    0.10mm/chip, L330×W250mm
    ±0.09mm/QFP (Max)
    YAMAHA YV100II 4 0.25 ± PCB:
    0.10mm/chip, L457×W305mm
    ±0.08mm/QFP (Max)
    YAMAHA YV112III 2 0.13 ± PCB:
    0.10mm/chip, L330×W407mm
    ±0.08mm/QFP (Max)
    YAMAHA YV88II 3 0.45 ± 1005chip-0.3mm
    0.08mm/chip, pitch QFP、BGA
    ±0.04mm/QFP & others PCB:
      L457×W407mm
      (Max)
    YAMAHA YV88X 1 0.45 ± Same to above
    0.08mm/chip,
    ±0.04mm/QFP
    JUKI KE760 1 0.32 ± Same to above
    0.10mm/chip,
    ±0.04mm/QFP
    Panasert MV2VB 5 0.1 ±0.10mm PCB:
    L330×W250mm
    (Max)
    SONY 1000 2 0.11      
    SONY 2000 2 0.11      
    Reflow HELLER 1500W 2 --   
    oven HELLER 1800EXL 2 --   
      SUN EAST HA-5CR 1 --   
      MT HZ-5CR 2 --   
      BTU TRS18-5 2 --   
    AOI SAKI TYPE-M 2 --   
    X-ray GLENBROOK RTX-113 1 --   
    tester
    Thick ASCENTEK ASM-K350 1 --   
    measurer
    BGA table FONTON BGA-935 1 --   
    Wave SUN EAST TURBO-300SS 1 -- Spraying;double waves
    soldering HOLLIS FUTURE I 1 -- Foaming;double waves
    Machines SOLTEC 6621 1 -- Spraying/Foaming;
      double waves
    ICT Teradyne Z1850 1 -- Dynamic test
    Testers TRI TRI-518F 3 -- Static test
    Washers HKD 3012 2 -- Ultrasound washing
    HK HK-85 1 -- Water washing